This video shows the surface of a polished silicon wafer is shown on which a rectangular structure with the footprint of 1x1 mm² is to be ablated with a USP laser. The ablation process can then be seen on a time scale in which the behaviour of the galvo scanner is easily comprehensible and shows a bidirectional scanning strategy. The step by step building up lines correspond to many single ablation events, which form the lines with a certain overlapping. The lines themselves are then arranged with an overlap so that they form full areas in one overscan. One overscan is completed in approximately 20 milliseconds, from overscan to overscan it becomes apparent that the depth of the structure increases. The process parameters applied result in a smooth surface without any deterioration, with an average laser power of about 50 W. Thanks to David Brinkmeier for recording this video as part of his Master’s thesis at BOSCH in Renningen, Germany.
Public Deliverables
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HC-PCF with improved PER at 1μm (20 dB) (M24). Lead Beneficiary UNILIM
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Process limits diamond (M24) Lead Beneficiary C4L
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Process limits fine cutting of metal (M34). Lead Beneficiary C4L
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Project Website Established (M03). Lead Beneficiary KITE
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Report on the performance of the 500 W demonstrator (3D-Si processing. Lead Beneficiary BOSCH
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System build up. Lead Beneficiary C4L
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Thin-disk multipass amplifier with 500W, 1MHz, sub-500 fs (M22). Lead Beneficiary USTUTT
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Video presentation of the HIPERDIAS project (M04). Lead Beneficiary KITE
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200-W, 500 fs laser 1MHz at 1030 nm for seeding an YbYAG amplifier (M21). Lead Beneficiary AMP
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50-W, 300-fs, 1-MHz laser for seeding an YbYAG Amplifier (2). Lead Beneficiary AMP
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Communication Kit Final Update (M46) Lead Beneficiary MODUS
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Communication Kit (M03). Lead Beneficiary KITE
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Communication Kit (M24). Lead Beneficiary MODUS
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D1.2 Process and System Specifications v1.0
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Design of the multipass amplifier (M06). Lead Beneficiary USTUTT
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End-capped PMC module for beam delivery (M30). Lead Beneficiary GLO
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Final version of PMC module for fiber beam delivery (1) (M24). Lead Beneficiary GLO