Reports

D2.1 - Process limits 3D Si Processing
D2.2 - Process limits fine cutting of metal
D2.3 - Process limits diamond processing
D2.4 - Processing strategies for high power 3D Si processing
D2.5 - Processing strategies for high power fine cutting of metals
D2.6 - Processing strategies for high power diamond processing
D3.3 - 200-W, sub-500-fs >1-MHz laser (1)
D3.4 - 200-W, sub-500-fs >1-MHz laser (2)
D4.3 - Report on fabrication and optical characterization of optimized gratings
D4.4 - Final version of PMC Module for Fiber Beam Delivery (1)
D4.5 - HC-PCF with improved PER at 1um (>20 dB)
D4.6 - End-capped PMC module for beam delivery
D4.7 - PMC module based on HC-PCF with improved PER at 1um (>20dB)
D4.8 - Final version of PMC module for Fiber Beam Delivery (2)
D5.2 - Thin-disk multipass amplifier with 500W, 1MHz, sub-500fs (1)
D5.3 - Thin-disk multipass amplifier with 500W, 1MHz, sub-500fs (2)
D5.4 - Demonstration of 200W green and 100W UV lasers beams at 1MHz and sub>500 fs pulse
D5.5 - Thin-disk multipass amplifier with 1000W, >=1MHz,sub-1ps
D6.2 - Definitions of Optic Constraints
D6.3 - System Layout
D6.4 - Integration of Laser and Optics
D6.5 - System build-up
D7.1 - Definitions of elements to integrate in the demonstrators
D7.2 - 500W System Test
D7.3 - 200W System Test
D7.4 - Testing of the optical fibre
D7.5 - Report on the perofrmances of the 500W Demostrator (3D-Si Procesing (1)
D7.6 - Report on the perofrmances of the 500W Demostrator (3D-Si Procesing (2)
D7.7 - Report on the Performance of 200W Demonstrator for diamond ablation
D7.8 - Report on the Performance of 200W Demonstrator for fine cutting metals
D7.9 - Report on the Performance of the 1000W Demonstrator
D8.5 - Communication Kit Mid-Term Update
D8.6 - Interim Exploitation and Dissemination Plan
D8.7 - Final Exploitaiton and IP Strategy
D8.8 - Communication Kit Update
D9.2 - 1st Periodic Report
D9.3 - 2nd Periodic Report
D9.4 - 3rd Periodic and Final Report